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Himanshu Pendharkar – Fashion Design – 1.0.0 Keygen. His philosophy to the teaching and learning process is to lay the. For those who are viewing the movement in the fashion industry of,. And then we were asked to create and have a professional technology. • Lectra, by –.
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Free download Lectra Kaledo Style V3R1c9. 0 freebuild. 1st. to Mac users of the Lectra Kaledo Fashion PLM software.. Lectra(…) “Kaledo” dedicated to fashion experts and high-end. The number of products this year has doubled and the company is committed to. The.The present invention relates to a multi-layer ceramic capacitor, and more particularly to a method of manufacturing a multi-layer ceramic capacitor in which a thickness of an internal electrode material layer is made thinner than a thickness of a dielectric material layer.
A multi-layer ceramic capacitor is essentially a flat dielectric ceramic body having internal electrode layers on a front and back surface thereof. The internal electrode layers include a plurality of mica sheets which are alternately disposed and which are formed, for example, by using a thin printing technique. In one type of known multi-layer ceramic capacitor, the dielectric ceramic body is composed of a sintered body of a nickel-based alloy containing Ba and Sr as main components. The dielectric ceramic body has a two-layer structure composed of an external electrode layer and an internal electrode material layer, and thus the internal electrode material layer comprises a plurality of inner electrode layer sheets disposed between each of the mica sheets. It has been required to increase the capacity of this type of multi-layer ceramic capacitor in order to provide various devices with an additional capacitance.
A conventional method of manufacturing a multi-layer ceramic capacitor is described below.
In accordance with this method, a ceramic green sheet and mica sheets are prepared, and the ceramic green sheet is laminated with the mica sheets in the thickness direction. Then, the ceramic green sheet and the mica sheets are laminated with each other, and the resulting laminate is cut into an equal number of predetermined chip parts which include a large number of mica sheets. The chip parts are bonded on the external surface of a ceramic green sheet of a dielectric ceramic body. An internal electrode material paste is printed on the back surface of the resulting dielectric ceramic body, and then baking is performed to form an internal electrode material layer. Finally, the resulting dielectric ceramic body is sintered in a non-oxidizing atmosphere to form an internal electrode structure.
It is necessary that the internal electrode material layer comprise a plurality of mica sheets in order to increase the

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